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Tag: AI Integration

Chiplets & Advanced Packaging Market Report 2025: AI Demand Fuels 2.5D/3D Integration Boom

Key Facts Introduction: Chiplets and 3D Integration Come of Age Semiconductor design is undergoing a paradigm shift from giant monolithic chips toward chiplet-based and multi-die architectures. In a chiplet approach, a processor is disaggregated into multiple smaller dies (chiplets) that are later integrated in a package, rather than one large die. This strategy improves manufacturing…
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