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Tag: Design

Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption

Chiplet architecture splits monolithic chips into multiple dies in a single package, improving wafer yields and reducing cost, with AMD reporting up to 70% cost reduction in EPYC servers versus a comparable single-die design. Chiplets enable mixing of process nodes, for example high-density cores on 5 nm while I/O dies run on 16 nm, maximizing…
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