TongFu Microelectronics stock drops 3% in Shenzhen trade as bond funding, PMI signals collide
TongFu Microelectronics’ A-shares fell 3.2% to 50.41 yuan in Shenzhen morning trading, with about 8.54 million shares exchanged. The company last week issued a 200 million yuan sci-tech bond at 1.77% yield. Traders weighed mixed factory data as global earnings season began. Official PMI slipped to 49.3, while the private index edged up to 50.3.
