SHE:002156.SZ 26 January 2026

Tongfu Microelectronics (002156.SZ) share price in focus after 200 million yuan sci-tech bond issue

Tongfu Microelectronics announced a 200 million yuan raise through a 270-day sci-tech innovation bond priced at 1.77%, according to a filing. The chip packaging and testing company is now on traders’ radar for the upcoming onshore session. The bond, maturing Oct. 26, was arranged by China Merchants Bank under a debt program registered with the China Interbank Market Dealers Association, the filing revealed.

1 February 2026

SHE:002156.SZ·Stock Market·Technology

TongFu Microelectronics stock faces a big Monday vote on a 4.4 bln yuan share sale

TongFu Microelectronics Co., Ltd.’s yuan-denominated Class A shares are in focus before Monday’s open, with shareholders due to vote later in the day on a package of proposals tied to a planned private placement of new stock. The company said the extraordinary meeting is scheduled for 2:30 p.m. local time in Nantong, Jiangsu province.

26 January 2026