Tongfu Microelectronics (002156.SZ) share price in focus after 200 million yuan sci-tech bond issue
Tongfu Microelectronics announced a 200 million yuan raise through a 270-day sci-tech innovation bond priced at 1.77%, according to a filing. The chip packaging and testing company is now on traders’ radar for the upcoming onshore session. The bond, maturing Oct. 26, was arranged by China Merchants Bank under a debt program registered with the China Interbank Market Dealers Association, the filing revealed.
