BE Semiconductor Industries shares slide as HBM rule shift rattles hybrid bonding bet
BE Semiconductor Industries shares dropped 8.4% to 172.75 euros in Amsterdam after reports that looser standards for high-bandwidth memory could delay adoption of its hybrid bonding tools. The selloff followed industry talk of raising stack thickness limits, potentially extending use of rival thermocompression bonding. Besi reported strong orders and forecast higher Q1 revenue, but investors reacted to uncertainty over future demand.