Tongfu Microelectronics (002156.SZ) share price in focus after 200 million yuan sci-tech bond issue
Tongfu Microelectronics raised 200 million yuan via a 270-day sci-tech innovation bond at 1.77%, maturing October 26, according to a filing. The company forecasts 2025 net profit of 1.1–1.35 billion yuan, up as much as 99% from last year. Tongfu’s shares closed at 52.06 yuan Friday, up 1.15%, but remain volatile. An equity raise is planned, pending regulatory approval.