TSX:3711 28 August 2025 - 15 December 2025

TSMC’s advanced CoWoS packaging is fully booked through 2025, despite doubling capacity yearly, as AI demand outpaces supply. Nvidia, AMD, Intel, Apple, and Amazon have adopted chiplet architectures, now generating over $40 billion in annual revenue. HBM chip lead times stretch up to a year, with prices up 20–30%. TSMC, Intel, ASE, and Amkor are racing to expand global advanced packaging capacity.