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Market Trends News 29 May 2025 - 14 July 2025

Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption

Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption

Chiplet architecture splits monolithic chips into multiple dies in a single package, improving wafer yields and reducing cost, with AMD reporting up to 70% cost reduction in EPYC servers versus a comparable single-die design. Chiplets enable mixing of process nodes,
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