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NASDAQ:INTC News 27 June 2025 - 21 July 2025

GPU Wars 2025: NVIDIA vs AMD vs Intel – The Ultimate Graphics Showdown

GPU Wars 2025: NVIDIA vs AMD vs Intel – The Ultimate Graphics Showdown

The GeForce RTX 4090 is the fastest gaming GPU in mid-2025, featuring 24 GB of GDDR6X, 3rd-gen RT cores, 4th-gen Tensor cores, and launched at $1,599 in 2022–2023. NVIDIA released the RTX 5090 in early 2025 as a halo card, but its supply is so limited that the RTX 4090 remains the practical top-end for most buyers. AMD’s Radeon RX 7900 XTX uses a chiplet RDNA3 design, includes 24 GB of GDDR6 memory, carries about 355 W board power, and is priced at $999. The RX 7900 XTX often trades blows with the RTX 4080, sometimes outperforming the 4080 in
21 July 2025
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Ultimate 2025-2026 Desktop PC & All-in-One Showdown: Top Picks for Every User

Ultimate 2025-2026 Desktop PC & All-in-One Showdown: Top Picks for Every User

In 2025 Dell retired its XPS, Inspiron, and OptiPlex brands in favor of a three‑tier “good‑better‑best” lineup: Dell, Dell Pro, and Dell Pro Max. HP unified its consumer PCs under the Omni branding in 2025, introducing OmniDesk desktops, OmniBook laptops, and OmniStudio all‑in‑ones. Apple’s Mac Studio (M2 Ultra, 2023) is a compact 3.7L system with up to 128GB RAM and a 60‑core GPU, while the Mac Pro (2023) offers 7 PCIe slots but cannot upgrade its GPU. At CES 2025 NVIDIA’s GeForce RTX 5090 features 92 billion transistors and 32GB of GDDR7 memory with DLSS 4, while top gaming desktops
19 July 2025
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Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption

Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption

Chiplet architecture splits monolithic chips into multiple dies in a single package, improving wafer yields and reducing cost, with AMD reporting up to 70% cost reduction in EPYC servers versus a comparable single-die design. Chiplets enable mixing of process nodes, for example high-density cores on 5 nm while I/O dies run on 16 nm, maximizing performance-per-cost. Chiplet designs decouple innovation paths, allowing CPU cores and memory/I/O to advance on separate timelines. The Universal Chiplet Interconnect Express (UCIe) defines a universal die-to-die interface with data rates from 8 to 32 GT/s, and UCIe 1.0 launched in 2022. 2.5D/3D packaging approaches such
13 July 2025
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Trusted Execution Environment (TEE) Hardware News – June–July 2025

Trusted Execution Environment (TEE) Hardware News – June–July 2025

Azure announced in June 2025 that SGX-based DCsv2 confidential VM instances will be retired by June 30, 2026, with SGX capacity restrictions starting July 1, 2025 and a migration to DCasv5/ECasv5 or DCasv6/ECasv6 confidential VMs using AMD SEV-SNP or Intel TDX. Intel’s 5th-Gen Xeon Emerald Rapids processors with Trust Domain Extensions (TDX) are debuting in cloud services, with Microsoft Azure launching a preview of TDX-powered VMs in April 2025. Linux kernel 6.16, released mid-2025, merged host support for Intel TDX, signaling readiness for broad deployment. Google Cloud has generally available AMD SEV-SNP-based VMs on 4th Gen EPYC Genoa servers, enabling
10 July 2025
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High-Performance Computing Highlights (June–July 2025): Exascale Era, HPC-AI Convergence, and Global Supercomputing Advances

High-Performance Computing Highlights (June–July 2025): Exascale Era, HPC-AI Convergence, and Global Supercomputing Advances

El Capitan at LLNL leads the June 2025 TOP500 with 1.742 exaFLOPS (HPL) using HPE Cray EX hardware, AMD 4th Gen EPYC CPUs, and MI300A accelerators. Frontier at ORNL is #2 with 1.353 exaFLOPS on HPL, powered by HPE Cray EX235a and AMD 3rd Gen EPYC CPUs plus MI250X GPUs. Aurora at Argonne is #3, delivering 1.012 exaFLOPS on HPL with Intel Xeon Max CPUs and Data Center GPU Max accelerators. JUPITER Booster at Jülich debuted at #4 with 0.793 exaFLOPS (partial) on a BullSequana-based system using NVIDIA Grace Hopper GH200 chips and built by Atos Eviden, containing about 4.8
9 July 2025
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Semiconductor Industry Roundup (June–July 2025): Advanced Chips, Equipment, and Geopolitics

Semiconductor Industry Roundup (June–July 2025): Advanced Chips, Equipment, and Geopolitics

In summer 2025, TSMC reported near 90% yield on its 3 nm process, versus Samsung’s roughly 50% yield. Samsung, which pioneered 3 nm gate-all-around transistors in 2022, continues to struggle with yields but has won Google’s Tensor G5 on 3 nm and other new clients for older nodes. TSMC and Samsung are racing toward 2 nm (N2-class) technology, with TSMC’s 2 nm on track for risk production and high-volume manufacturing in late 2025 or early 2026. Intel detailed an 18A process (approximately 1.8 nm class) at the mid-June VLSI Symposium, promising >30% logic density scaling and up to ~20% higher
1 July 2025
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Global Semiconductor Industry Trends and 2025 Outlook: AI Boom, Advanced Nodes, and Geopolitics (Report: June 27th, 2025)

Global Semiconductor Industry Trends and 2025 Outlook: AI Boom, Advanced Nodes, and Geopolitics (Report: June 27th, 2025)

Global semiconductor revenue reached $626 billion in 2024, up 18.1% from 2023, with Gartner projecting about $705 billion in 2025. Data-center AI chip sales rose to $112 billion in 2024, up from $64.8 billion in 2023, making generative AI workloads the second-largest semiconductor market after smartphones. Memory revenue jumped about 72% in 2024 and accounted for roughly 25% of total market, with HBM revenues expected to grow 66% in 2025 to $19.8 billion. TSMC’s 2nm node (N2) is in pilot production with high-volume manufacturing planned for 2H 2025, aiming for about 50,000 wafer starts per month by end-2025, with Apple
27 June 2025
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Stock Market Today

Netflix stock price ends higher as DOJ widens review of Warner deal — what to watch next week

Netflix stock price ends higher as DOJ widens review of Warner deal — what to watch next week

7 February 2026
Netflix shares rose 1.6% to $82.20 Friday as the Justice Department expanded its antitrust review of the company’s planned $82.7 billion Warner Bros Discovery acquisition. A Wall Street Journal report said investigators are probing possible anti-competitive tactics. Director Reed Hastings reported a transfer of 241,944 shares via a family trust, according to an SEC filing.
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