Shanghai, Jan 19, 2026, 10:12 GMT+8 — Regular session
- JCET Group’s A-shares climbed in morning trading, extending last week’s strong rally.
- A fresh brokerage note highlighted capacity expansion alongside discussions of packaging price hikes linked to AI and memory demand.
- Traders are eyeing whether the China chip rally can match the momentum of global semiconductor earnings set for later this month.
JCET Group Co., Ltd.’s A-shares on the Shanghai market climbed Monday morning, extending gains for China’s chip supply-chain sector. By 10:10 a.m., the stock was trading 2.6% higher at 49.66 yuan, after hitting a session peak of 50.76 yuan. (CFI Quotes)
This matters because “advanced packaging” has turned into a bottleneck in the chip supply chain. It’s the process that wraps, links, and increasingly stacks chips and memory—a crucial element for many AI tasks. Investors see it as a purer way to play demand without directly holding a chip designer’s stock.
Global cues shaped the mood. TSMC announced it will boost capital spending for 2026 to between $52 billion and $56 billion, a move seen as a clear signal of ongoing AI expansion. “The market has underestimated again how large is the demand for AI,” said Han Dieperink, chief investment officer at Aureus. (Reuters)
In China, a new brokerage note stirred things up. On Sunday, Kaiyuan Securities analyst Chen Rongfang said the packaging and testing sector is entering an “expansion + price hike” phase, driven by strong AI and memory-related demand alongside rising input costs. Chen highlighted that packaging companies “may pass on cost pressures through price adjustments” to keep profits steady, noting some Taiwan packaging lines have reported price increases as high as 30%, with others possibly seeing hikes between 5% and 20%. (发现报告)
Money poured into the theme late last week. According to a Securities Times DataBao report, the “memory chip” sector jumped 4.08% on Friday, while “advanced packaging” climbed 3.53%. JCET hit its 10% daily trading ceiling. The data also revealed that “main” fund flows net purchased roughly 2.41 billion yuan in JCET shares. (STCN)
Leverage kicked in. Margin financing net buys in JCET hit 461 million yuan on Friday, pushing the stock’s financing balance to 36.5 billion yuan, according to a Securities Star post based on public figures. Margin financing allows investors to borrow money to purchase shares. (Caifuhao)
The wider wager is that advanced packaging will claim an even larger slice of chip value as AI chips become more intricate. Securities Times noted advanced packaging made up around 8% of TSMC’s revenue in 2025 and might surpass 10% this year, with Chinese packagers ramping up capacity and moving into more sophisticated work. (STCN)
Peer stock action was varied, yet the sector held steady. Shenzhen-listed Huatian Technology gained roughly 0.9% by 10:13 a.m., per CFI data. (Cfi)
JCET’s net profit dropped 11.39% in the first nine months of 2025, even though revenue climbed 14.78%. That shows how rising costs and scale-up efforts can squeeze margins despite stronger demand. Shares have already jumped 31.57% since the start of the year through Friday’s close, leaving less wiggle room if pricing pressures ease or the sector cools. (STCN)
Global chip earnings are the next key trigger. Investors are eyeing ASML’s Q4 and full-year results set for Jan. 28, looking for fresh insights on industry spending. They’ll also be hunting for updates on packaging capacity and pricing that might shift forecasts for companies like JCET. (Asml)
