Broadcom stock (AVGO) set for key week after 3D-stacked chip push, earnings next
Broadcom Inc. has set its sights on moving at least 1 million units of its 3D-stacked chip design by 2027, marking out a fresh milestone for tech the firm claims will ramp up AI computing while slashing energy demands. “Now, pretty much all of our customers are adopting this technology,” Harish Bharadwaj, vice president of product marketing, told Reuters. According to Bharadwaj, the 3D-stacked setup fuses two chips to accelerate data transfer and can improve energy efficiency about ten-fold.
