NEW YORK, Feb 28, 2026, 10:39 EST — Markets are shut.
- Broadcom set out a new sales goal for 2027, pointing to chips built with its 3D-stacked design tech—another signal of its drive in custom AI silicon.
- The company said it’s begun shipping a 2-nanometer custom compute chip to Fujitsu, built with its 3.5D packaging platform.
- U.S. markets are back in action Monday. Broadcom delivers quarterly results March 4.
Broadcom Inc. has set its sights on moving at least 1 million units of its 3D-stacked chip design by 2027, marking out a fresh milestone for tech the firm claims will ramp up AI computing while slashing energy demands. “Now, pretty much all of our customers are adopting this technology,” Harish Bharadwaj, vice president of product marketing, told Reuters. According to Bharadwaj, the 3D-stacked setup fuses two chips to accelerate data transfer and can improve energy efficiency about ten-fold. Reuters
Broadcom (AVGO) shares slipped 0.67% to finish at $319.55 on Friday. U.S. markets will be closed Saturday, but on Monday, traders return to a chip space hypersensitive to AI-driven spending and margin signals. Broadcom’s earnings land midweek.
Broadcom announced on Feb. 26 that it’s now shipping what it touts as the industry’s first 2-nanometer custom compute system-on-a-chip to Fujitsu, using its 3.5D “XDSiP” platform. The SoC integrates several functions into a single package. “We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu,” said Frank Ostojic, senior vice president and general manager for Broadcom’s ASIC products division. He also noted that they’re planning shipments to a wider set of customers starting in the second half of 2026. GlobeNewswire
No lift from the broader market. U.S. stocks slipped Friday, dragged down by tech and financials, as a surprise jump in producer prices jolted investors and renewed uncertainty about the Fed’s rate-cut timeline. “Adding to the day’s weakness was the hotter inflation data,” said Ryan Detrick, Carson Group’s chief market strategist, in comments to Reuters. Reuters
Semiconductors have shown some fatigue lately. “Now it’s time for a breather,” said Talley Leger, chief market strategist at The Wealth Consulting Group. After a lengthy rally, a lot of positive news is already baked in, Leger noted. Reuters
Broadcom will release its fiscal first-quarter numbers after markets close Wednesday, March 4. Analysts polled by Refinitiv are looking for earnings to come in at $2.02 per share, with revenue pegged at $19.11 billion, according to Kiplinger. Susquehanna’s Christopher Rolland flagged strong demand in a note, highlighting custom ASICs—chips tailored for specific tasks—and AI networking as key growth drivers.
Investors aren’t just tuning in for the headline figures. They’re after clarity on custom AI chip demand, the pace at which fresh designs shift from samples to large-scale shipments, and any commentary from the company on profit trends as AI plays a bigger role in the mix.
But there’s a catch: advanced packaging and the most cutting-edge nodes take serious effort—and money. Timelines slip. If customers hold back rollouts or yields fall short, what looks like a solid story can quickly become postponed revenue and a stock that swings hard.
Broadcom’s move further into custom AI chips keeps it among the likes of Nvidia and AMD as hyperscalers shuffle their budgets. That’s a boost when investment heats up; it stings when the market pulls back and sheds risk on the sector.
March 4 stands out as the next hard catalyst. Traders are set to zero in on Broadcom’s outlook, along with any specifics about shipments linked to the new 3D-stacked program as 2026’s second half comes into view.
