Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption
Chiplet architecture splits monolithic chips into multiple dies in a single package, improving wafer yields and reducing cost, with AMD reporting up to 70% cost reduction in EPYC servers versus a comparable single-die design. Chiplets enable mixing of process nodes, for example high-density cores on 5 nm while I/O dies run on 16 nm, maximizing performance-per-cost. Chiplet designs decouple innovation paths, allowing CPU cores and memory/I/O to advance on separate timelines. The Universal Chiplet Interconnect Express (UCIe) defines a universal die-to-die interface with data rates from 8 to 32 GT/s, and UCIe 1.0 launched in 2022. 2.5D/3D packaging approaches such
