Chiplet Technology 2025: Design Tools, Yield Challenges, and Market Adoption
AMD reports up to 70% cost reduction in EPYC servers using chiplet architecture versus single-die designs. Chiplets allow mixing process nodes, as seen in Nvidia’s Grace Hopper and Intel’s Ponte Vecchio, and are now standard in HPC and AI. UCIe 1.0 launched in 2022, defining a universal die-to-die interface. Automotive chiplet adoption is set for 2025, with TSMC and Imec preparing qualified packaging and process kits.