Artificial Intelligence 28 February 2026 - 5 March 2026

Micron Technology on Tuesday announced it’s now sampling what it bills as the industry’s highest-capacity low-power DRAM module, a 256GB SOCAMM2, aimed squarely at AI data centers feeling the pinch from power and heat constraints. “Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution,” said Raj Narasimhan, senior vice president and general manager for the company’s Cloud Memory Business Unit. Nvidia’s Ian Finder, head of Product for Data Center CPUs, called the new module “enabling the next generation of AI CPUs.”