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KRX:000660 24 July 2025 - 28 August 2025

Chiplets & Advanced Packaging Market Report 2025: AI Demand Fuels 2.5D/3D Integration Boom

Chiplets & Advanced Packaging Market Report 2025: AI Demand Fuels 2.5D/3D Integration Boom

TSMC’s advanced CoWoS packaging is fully booked through 2025, despite doubling capacity yearly, as AI demand outpaces supply. Nvidia, AMD, Intel, Apple, and Amazon have adopted chiplet architectures, now generating over $40 billion in annual revenue. HBM chip lead times stretch up to a year, with prices up 20–30%. TSMC, Intel, ASE, and Amkor are racing to expand global advanced packaging capacity.
28 August 2025
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Apple’s $100B Surprise, Space Startup Soars, and Tech Glitches Galore – Tech News Roundup (Aug 6–7, 2025)

Apple’s $100B Surprise, Space Startup Soars, and Tech Glitches Galore – Tech News Roundup (Aug 6–7, 2025)

Apple will invest $100 billion in US manufacturing, expanding Corning’s Kentucky glass production and partnering with Samsung on new chipmaking at its Texas fab. Sony raised its annual profit forecast to ¥1.33 trillion and cut its expected tariff impact, with PlayStation network services driving growth; shares rose 5%.
7 August 2025
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Shockwaves in Silicon: Global Chip Industry’s Two-Day Upheaval (July 23–24, 2025)

Shockwaves in Silicon: Global Chip Industry’s Two-Day Upheaval (July 23–24, 2025)

SK Hynix posted record Q2 results, with operating income up 69% to ₩9.2 trillion and revenue up 35% to ₩22.2 trillion, overtaking Samsung as the world’s top memory chipmaker on HBM demand. Intel is shifting from the 18A to 14A process under new CEO Lip-Bu Tan and is expected to post its sixth straight quarterly net loss. Nvidia’s H20 AI chip sales to China resumed after U.S. approval, boosting TSMC demand.
24 July 2025
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