NVIDIA’s Rubin AI Chip Ramp Hits Fresh Snag as HBM4 Memory Crunch Clouds 2026
TrendForce said April 8 that Nvidia’s Rubin AI chip shipments may be delayed by HBM4 memory qualification and cooling demands, shifting over 70% of 2026 high-end GPU volume to the current Blackwell line. Rubin’s projected share dropped to 22%. Samsung began shipping HBM4 to Nvidia in February, but SK Hynix and Micron face qualification delays. Broadcom signed a long-term deal to develop Google’s TPUs through 2031.