Chiplets & Advanced Packaging Market Report 2025: AI Demand Fuels 2.5D/3D Integration Boom
Key Facts Introduction: Chiplets and 3D Integration Come of Age Semiconductor design is undergoing a paradigm shift from giant monolithic chips toward chiplet-based and multi-die architectures. In a chiplet approach, a processor is disaggregated into multiple smaller dies (chiplets) that are later integrated in a package, rather than one large die. This strategy improves manufacturing yield and cost – smaller dies are easier to produce without defects – and allows mixing different process nodes and functions in one package astutegroup.com astutegroup.com. As traditional 2D scaling hits physical and economic limits, chiplets offer a practical path to keep improving performance and
